Soft Error-Mitigating Semiconductor Design System and Associated Methods

ABSTRACT

A soft error-mitigating semiconductor design system and associated methods that tailor circuit design steps to mitigate corruption of data in storage elements (e.g., flip flops) due to Single Events Effects (SEEs). Required storage elements are automatically mapped to triplicated redundant nodes controlled by a voting element that enforces majority-voting logic for fault-free output (i.e., Triple Modular Redundancy (TMR)). Storage elements are also optimally positioned for placement in keeping with SEE-tolerant spacing constraints. Additionally, clock delay insertion (employing either a single global clock or clock triplication) in the TMR specification may introduce useful skew that protects against glitch propagation through the designed device. The resultant layout generated from the TMR configuration may relax constraints imposed on register transfer level (RTL) engineers to make rad-hard designs. as automation introduces TMR storage registers, memory element spacing, and clock delay/triplication with minimal designer input.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation and claims the benefit under 35U.S.C. § 120 of U.S. patent application Ser. No. 17/187,516 filed by theinventor of the present application on Feb. 26, 2021 and titled SOFTERROR-MITIGATING SEMICONDUCTOR DESIGN SYSTEM AND ASSOCIATED METHODS, theentire contents of which are incorporated herein by reference.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

The invention described in this patent application was made withGovernment support under the Fermi Research Alliance, LLC, ContractNumber DE-AC02-07CH11359 awarded by the U.S. Department of Energy. TheGovernment has certain rights in the invention.

FIELD OF THE INVENTION

The present invention relates generally to mitigation of radiationeffects on electronic devices and, more particularly, to semiconductordesign automation configured to model for mitigation of single eventeffect (SEE) soft errors.

BACKGROUND OF THE INVENTION

The present invention relates to the field of mitigation of radiationeffects on semiconductor devices such as integrated circuits (ICs).Interaction of a circuit's silicon with a single energetic particle(such as a strike by a heavy ion, alpha particle, electron, proton, orneutron) may cause a measurable effect on the circuit, up to andincluding operational malfunction. An ionizing particle strike mayintroduce electron-hole pairs in the bulk of a semiconductor device, andthese carriers may get collected at device nodes owing to drift anddiffusion mechanisms. Such radiation-induced events, also known asSingle Event Effects (SEEs), may arise when the collected fraction ofcharge from ionizing particles is larger than the existing electriccharge stored on a device node.

SEEs may be further subclassified as hard errors and soft errors. A harderror introduces permanent damage to a semiconductor device that isimpacted by a particle. A soft error, while not fatal to asemiconductor, may adversely change the state of data stored on one ormore sequential elements in a digital device and/or may affect theperformance of analog components like operational amplifiers,regulators, comparators, and oscillators. Two types of SEE soft errorsof particular interest to circuit design engineers are Single EventUpsets (SEUs) and Single Event Transients (SETs).

An SEU is characterized by a single energetic-particle strike causingcorruption (e.g., a change of state or “bit flip”) of a sequentialelement such as a storage node/register in a microelectronic device(e.g., a microprocessor, semiconductor memory, or power transistor). AnSET is characterized by a single energetic-particle strike causing amomentary voltage spike at a node (e.g., a combinational gate) in anintegrated circuit that subsequently propagates to the device output. Asused hereinafter, such a false or spurious electronic signal caused by abrief, unwanted surge of electric power may be referred to as a“glitch.” The SEE summary schematic 100 of FIG. 1 illustrates SEUs 130potentially manifesting as output signals of various storagenodes/registers 102 within a device and also illustrates SETs 132potentially introduced within combinational data paths 140 and/or clockbuffers 150 employed within a clock tree 112 of a device.

Single Event Upsets (SEUs) and Single Event Transients (SETs) are commonin detector electronics for high-energy physics applications, becausesuch detectors are exposed to energetic ionizing particles from theparticle collisions that are inherent to such applications. Ashigh-energy physics advancements move, for example, from the LargeHadron Collider (LHC) to the High Luminosity LHC (HL-LHC) configuration,SEEs have the potential to significantly compromise the reliability ofsuch electronic systems.

The effect of soft errors on circuits may be mitigated at various designlevels: technology, cell, or system. At the technology level, forexample, Silicon On Insulator (SOI) based devices are resistant to SEEsas the ionizing path in the bulk is quite small compared to planar bulkComplementary Metal-Oxide Semiconductor (CMOS). Also for example, at thecell level, increasing the device node capacitance increases thecritical charge to hold the logic state, thereby making the cell lesssusceptible to SEEs. At the system level, the most prominent methodologyfor mitigating the impact of soft errors in storage nodes is employmentof Triple Modular Redundancy (TMR). TMR is a way of storing the samedata on multiple nodes in the circuit design to achieve a fault-tolerantform of system-level redundancy.

In a typical TMR implementation, three systems perform a commoncomputation and the results of each is processed by a majority-votingsystem to produce a single output. By design, if any one of the threesystems fails, the other two systems may be polled by the voting systemto identify the failure and, accordingly, to correct and/or mask thefault. FIGS. 1B, 2A, and 2B illustrate an exemplary TMR implementationas known in the art. For example, the D flip-flop 102 shown in FIG. 1Bis a memory storage element commonly used in digital designs. Flip-flop102 features a data input (Din) state 110 and a data output (Dout) state120. Dout 120 is configured to change state based on Din 110, but onlyin the presence of a clock signal (Clk) 112. For example, flip-flop 102may be implemented to only allow the input Din 110 to affect the outputDout 120 state when the clock Clk 112 is HIGH (e.g., set to 1). Thus, Dflip-flop 102 may operate as a controlled bi-stable latch with the clocksignal at Clk 112 serving as the control signal. Flip-flop 102 mayfurther feature a Set 130 input and a Reset 132 input. A HIGH signal tothe Set 130 pin may set output Dout 120 to 1. Conversely, a HIGH signalto the Reset 132 pin may cause output Dout 120 to go to LOW (e.g., resetto 0).

FIG. 2A illustrates employment of D flip-flops in an exemplary TMRimplementation 200 as known in the art. Input data Din 210 may be storedin sequential elements (i.e., flip-flops 102(a), 102(b), and 102(c)) onthese elements' respective clock edges 112(a), 112(b), and 112(c). Theinput data Din 210 may be latched on the three flip-flops 102(a),102(b), 102(c) and a voter element 204 may process the flip-flops'respective outputs Q1 120(a), Q2 120(b), and Q3 120(c) to determine afinal output Q 220. As illustrated in the truth table 230 of FIG. 2B,the voter 204 may enforce logic (Q=Q1 &Q2|Q2&Q3|Q3&Q1) to decide thefinal output Q 220. Such a TMR implementation 200 may mitigate theeffect of an SEE on any one of the storage nodes 102(a), 102(b), 102(c)by ensuring the output Q 220 receives the correct value from theremaining two uncorrupted nodes.

FIG. 3A illustrates an exemplary Single Event Transient (SET) scenario300 as known in the art. As shown, an ionizing particle strike 302 at agate in a combinational data path may produce a glitch 304. As describedabove, the propagation of this glitch 302 forward from the impacted gateis termed an SET. The glitch 304 may be captured in a downstreamregister(s) 310 if the SET arrives as input 314 during the shared Clk112 clock edge 320 (a phenomenon referred to as SET latching). Asillustrated in FIG. 3B, introduction of clock skew 360 (also referred toas “useful skew”) is one known method of avoiding glitch propagationthrough a microelectronic device. As shown, the clock signal Clk 112 maydrive a first clock Clk1 312 on a first storage node 370, while thatclock signal Clk 112 may be offset by delay logic 350 before driving asecond clock Clk2 314 on a second storage node 372. An ionizing particlestrike 362 at a gate in a combinational data path may produce glitch364. However, this glitch 364 may be masked from downstream node 372because this SET 364 is not allowed to arrive as input 374 during theClk 314 clock edge 380.

Although the SEE-mitigating techniques 200 and 360 of FIGS. 2A and 3B,respectively, may be sound in the abstract, a design engineer must beconcerned with optimization as a specification is carried toimplementation. For example, data replication on multiple nodes comes atthe cost of additional area and power consumption. Also for example, adesign engineer is burdened to ensure that decisions made regardingimplementation of a design specification do not inadvertently defeatoperational requirements (e.g., expose more than one storage node in aTMR configuration to corruption by a common SEU; fail to account for anSET in a delay logic/clock buffer itself). In circuit designengineering, logic synthesis is a process by which an abstractspecification of required circuit behavior is turned into a designimplementation in terms of logic gates. Design implementation detailsare commonly defined at the register transfer level (RTL) using acomputer program called a synthesis tool. RTL is a design abstractionthat models a synchronous digital circuit in terms of the flow ofdigital signals (data) between hardware registers, and the logicaloperations performed on those signals. RTL abstraction is used inhardware description languages (HDLs) like Verilog and Very High-SpeedIntegrated Circuit Hardware Description Language (VHDL) to createhigh-level representations of a circuit from which lower-levelrepresentations and, ultimately, actual wiring configurations may bederived.

Accordingly, a need exists for a solution to at least one of theaforementioned challenges in circuit design specification andoptimization. More specifically, a need exists for an automatedmethodology that equips circuit design engineers to more easily,quickly, and/or correctly produce SEE-tolerant standard cell-baseddigital designs. These are all features and capabilities of the presentinvention as disclosed and claimed, which provides solutions to themultiple shortcomings of prior art inventions in this field.

This background information is provided to reveal information believedby the applicant to be of possible relevance to the present invention.No admission is necessarily intended, nor should be construed, that anyof the preceding information constitutes prior art against the presentinvention.

SUMMARY OF THE INVENTION

With the above in mind, embodiments of the present invention are relatedto a soft error-mitigating semiconductor design system and associatedmethod(s) to provide automated circuit design tailored to mitigate SEEsmanifesting as soft errors. Embodiments of the present invention mayadvantageously improve known TMR automation methodology for SEUmitigation by introducing additional stages/steps to maprequirement-driven registers with triplicated cells during synthesis andalso with additional spacing constraints during placement and routing tooptimize distance between memory elements in a TMR. Additionally, clockdelay insertion and/or clock triplication may be applied during clocktree distribution to augment the TMR specification for SET mitigation.

In one embodiment of the present invention, a soft error-mitigatingsemiconductor design system comprising a synthesis subsystem configuredto receive a circuit design specification represented in a hardwaredescription language (e.g., Verilog, Very High-Speed Integrated CircuitHardware Description Language (VHDL)). The circuit design specificationmay comprise one or more sequential element definitions (e.g., storagenodes, such as flip-flops). Using the sequential element definition(s)as input, the synthesis subsystem may generate a triple modularredundancy (TMR) configuration that may apply three redundant sequentialelements to implement each desired sequential element in a design. TheTMR configuration may further comprise a voter element definitionconfigured to receive a respective output from each of the threeredundant sequential element definitions and to generate, usingmajority-voting logic, a fault-free output. The TMR configuration may bewritten to a netlist generated by the synthesis subsystem.

The soft error-mitigating semiconductor design system may furthercomprise a physical design subsystem configured to receive the netlistand determine a spatial separation to be applied to the three redundantsequential elements in the TMR configuration. The spatial separationdefinition may employ an SEE-mitigating spacing constraint. In addition,the physical design subsystem may be configured to determine a usefulclock skew to insert into the TMR configuration. In one embodiment, theclock skew insertion definition may comprise a single global clocksignal configured to drive each of three delay logic elements. Each ofthree delay logic elements may be characterized by a respective offsetthat is distinct from each other's offset (i.e., the delay offsets aredistinct). In another embodiment, the clock skew insertion definitionmay comprise three clock signals each configured to drive a respectiveone of three delay logic elements. Once again, each of three delay logicelements may be characterized by a respective offset that is distinct.The physical design subsystem may generate a layout from the TMRconfiguration and including the spatial separation definition and theapplied clock skew insertion definition.

These and other objects, features, and advantages of the presentinvention will become more readily apparent from the attached drawingsand the detailed description of the preferred embodiments, which follow.

BRIEF DESCRIPTION OF THE DRAWINGS

The preferred embodiments of the invention will hereinafter be describedin conjunction with the appended drawings provided to illustrate and notto limit the invention, where like designations denote like elements,and in which:

FIG. 1A is a schematic diagram illustrating Single Event Effect (SEE)impact points in exemplary digital logic according to the prior art;

FIG. 1B is a schematic diagram illustrating an exemplary D-flip flopspecification according to the prior art;

FIG. 2A is a schematic diagram illustrating an exemplary triple modularredundancy (TMR) specification according to the prior art;

FIG. 2B is a truth table illustrating exemplary operation of the TMRspecification of FIG. 2A;

FIG. 3A is a schematic diagram illustrating an exemplary SET latchingspecification and latching timing model according to the prior art;

FIG. 3B is a schematic diagram illustrating an exemplary clock skewspecification and skew timing model according to the prior art;

FIG. 4 is a schematic diagram illustrating delay insertion in a TMR nodespecification with single clock according to an embodiment of thepresent invention;

FIG. 5A is a schematic diagram illustrating delay insertion in a TMRmulti-module specification with clock triplication according to anembodiment of the present invention;

FIG. 5B is a schematic diagram illustrating clock triplication generatedfrom a single global clock according to an embodiment of the presentinvention;

FIG. 6 is a block diagram describing a soft error-mitigatingsemiconductor design method according to an embodiment of the presentinvention;

FIG. 7 is a software script implementing exemplary digital designspecification steps according to a first embodiment of the presentinvention;

FIG. 8A is a software script implementing exemplary digital designspecification steps according to a second embodiment of the presentinvention;

FIGS. 8B, 8C and 8D each is a respective software script implementing aTMR specification according to a respective embodiment of the presentinvention;

FIG. 9 is a software script implementing memory elements spatialseparation according to an embodiment of the present invention;

FIG. 10 is a software script implementing clock triplication delayinsertion according to an embodiment of the present invention; and

FIG. 11 is a schematic block diagram of a soft error-mitigatingsemiconductor design system according to an embodiment of the presentinvention.

Like reference numerals refer to like parts throughout all views of theFigures (i.e., parts are not re-numbered for identification in differentFigures).

DETAILED DESCRIPTION OF THE INVENTION

The present invention will now be described more fully hereinafter withreference to the accompanying drawings, in which preferred andalternative embodiments of the invention are shown. This invention may,however, be embodied in many different forms and should not be construedas limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the invention to those ofordinary skill in the art.

Although the following detailed description contains many specifics forthe purposes of illustration, anyone of ordinary skill in the art willappreciate that many variations and alterations to the following detailsare within the scope of the invention. Accordingly, the followingembodiments of the invention are set forth without any loss ofgenerality to, and without imposing limitations upon, the claimedinvention.

As used herein, the word “exemplary” or “illustrative” or “shown” means“serving as an example, instance, or illustration.” Any implementationdescribed herein as “exemplary” or “illustrative” is not necessarily tobe construed as preferred or advantageous over other implementations.All of the implementations described below are exemplary implementationsprovided to enable persons of ordinary skill in the art to make or usethe embodiments of the disclosure without undue experimentation or adegree of experimentation beyond that which is customary in the art, andare not intended to limit the scope of the disclosure, which is definedby the claims.

Referring to FIGS. 4, 5A, 5B, 6, 7, 8A, 8B, 8C, 8D, 9, 10 and 11 , asoft error-mitigating semiconductor design system and associated methodaccording to an embodiment of the present invention is now described indetail. Throughout this disclosure, the present invention may bereferred to as a soft error-mitigating semiconductor design system,tool, or method; a SEE-mitigating design system, tool, or method; asemiconductor design system, tool, or method; a design system, tool, ormethod; or a system, a tool, and/or a method. Those skilled in the artwill appreciate that this terminology is only illustrative and does notaffect the scope of the invention. For instance, the present inventionmay just as easily relate to any computer-assisted methodology forstandard cell-based digital design.

A person of skill in the art will immediately recognize that developmentof large digital designs may be made more manageable by employment ofcomputer-aided design (CAD) tools to translate a behavioral circuitdescription into a desired logic. Electronic computer-aided design(ECAD), also referred to as electronic design automation (EDA), is acategory of software tools for designing electronic systems such asintegrated circuits and printed circuit boards. Because a modernsemiconductor chip may comprise billions of components, EDA tools areessential for successful design of complex solutions. Such tools oftenwork together in a design flow that chip designers may use to design andanalyze entire semiconductor chips.

SEE Tolerant Design

Referring initially to FIG. 4 , a circuit design characterized by triplemodular redundancy (TMR) with clock skew/delay according to anembodiment of the present invention will now be described in detail. Forexample, and without limitation, the basic design 400 may be configuredto receive an input data Din 410 that may be stored in sequentialelements (i.e., flip-flops 402(a), 402(b), and 402(c)) on theseelements' respective clock edges, which each may be offset from a globalclock signal Clk 112 by respective delay logic 450(a), 450(b), 450(c) ofdiffering delay values. The input data Din 410 may be latched on thethree flip-flops 402(a), 402(b), 402(c) and a voter element 404 mayprocess the flip-flops' respective outputs Q1 420(a), Q2 420(b), and Q3420(c) to determine a final output Q 422. Similar to in the truth table230 of FIG. 2B, the voter 404 may enforce logic (Q=Q1 &Q2|Q2&Q3|Q3&Q1)and, in doing so, may mitigate the effect of an SEE on any one of thestorage nodes 402(a), 402(b), 402(c) by ensuring the output Q 422receives the correct value from the remaining two non-corrupted nodes.Additionally, introduction of the useful clock skews 450(a), 450(b),450(c) in line with flip-flops 402(a), 402(b), 402(c) may prevent aglitch introduced at input Din 410 from propagating through the system400 by masking the glitch from a majority of the storage nodes 402(a),402(b), 402(c).

Referring now to FIG. 5A, a circuit design characterized by multi-moduletriple modular redundancy (TMR) with delay employed in clocktriplication according to an embodiment of the present invention willnow be described in detail. For example, and without limitation, theadvanced design 500 may be configured to receive an input data Din 510that may be input (either directly, or after manipulation by othercombinational data path logic) to multiple TMR modules 520, 522. Eachmodule may be characterized by the general configuration 400 illustratedin FIG. 4 . More specifically, module 520 may comprise sequentialelements (i.e., flip-flops 502(a), 502(b), and 502(c)) configured toreceive input on their respective clock edges, each of which may beoffset from a respective driving clock signal by respective delay logic550(a), 550(b), 550(c) of differing delay values. Voter element 504 mayprocess the module 520 flip-flops' respective outputs to determine afinal output for module 520. Similarly, module 522 may comprisesequential elements (i.e., flip-flops 572(a), 572(b), and 572(c))configured to receive input on their respective clock edges, each ofwhich may be offset from a respective driving clock signal by respectivedelay logic 580(a), 580(b), 580(c) of differing delay values. Voterelement 594 may process the module 522 flip-flops' respective outputs todetermine a final output for module 522. Similar to in the truth table230 of FIG. 2B, the voters 504, 594 may enforce logic (Q=Q1&Q2|Q2&Q3|Q3&Q1) and, in doing so, may mitigate the effect of an SEE onany one of the storage nodes in either module 520, 522. Additionally,triplication of clocks Clk1 582, Clk2 584, and Clk3 586 may be employedto advantageously facilitate driving clock signal asynchrony to preventglitch propagation. Furthermore, introduction of differing useful clockskews may provide additional SET mitigation. For example, and withoutlimitation, FIG. 5A illustrates Clk1 582 driving storage node 502(a)through single delay 550(a), Clk2 584 driving storage node 502(b)through single delay 550(b), and Clk3 586 driving storage node 502(c)through single delay 550(c). FIG. 5A also illustrates Clk1 582 drivingstorage node 572(a) through two delays 560(a), 580(a); Clk2 584 drivingstorage node 572(b) through two delays 560(b), 580(b); and Clk3 586driving storage node 572(c) through two delays 560(c), 580(c).

Still referring to FIG. 5A, and referring additionally to FIG. 5B, acircuit design characterized by clock triplication implemented as phasesgenerated from a global clock according to an embodiment of the presentinvention will now be described in detail. Instead of, or in additionto, employing multiple clocks (illustrated as Clk1 582, Clk2 584, andClk3 586 in FIG. 5A) in the present invention, a phase generation designsuch as a delay locked loop (DLL) or a phase locked loop (PLL) may beemployed. For example, and without limitation, the single DLL design 570of FIG. 5B may be configured to receive a global clock signal 584 and toprecisely delay the travel of clock transitions down a line of delayelements 540(a), 540(b), 540(c), 540(d). The delay may be controlled bycircuitry which compares the input global (or reference) clock with theoutput of the delay line and adjusts the delay of the delay elementsuntil they match, meaning the total delay of the delay line may be oneclock period. One possible configuration of circuitry of a DLL that maymanage the delay line may include a phase detector (or phase frequencydetector) 530, a charge pump 532, and a loop filter 534. A person ofskill in the art will immediately recognize that alternative DLLconfigurations, and/or alternative phase generation systems altogether,may be similarly employed as part of the present invention. In theexample design of FIG. 5B, the output of each of the delay elementsselected for inclusion in the delay line may be directed to some numberof multiplexers (not necessarily limited to two multiplexers 554, 574 asshown) to facilitate selection of the Δt between delay element stages. Aperson of skill in the art will immediately recognize that multiplexersare optional in a working DLL design. Operation of the DLL design 570may generate a Clk Del1 584 and a Clk Del2 586 from the global Ref Clock582. In this manner, clock triplication 582, 584, 586 may be achievedfrom a single clock.

Referring now to FIG. 6 , a soft error-mitigating semiconductor designmethod 600 according to an embodiment of the present invention will nowbe described in detail. The standard cell-based design method 600 mayinclude automated support for traditional semiconductor design phases,including Specification 610, Logic Design 620, Synthesis 630, PhysicalDesign 640, and Physical Verification 660 phases. Additionally, themethod 600 may include semi-custom design flow automation directed toTMR insertion 632 during Synthesis 630, as well as to memory elementsspatial separation 644 and to clock delay/skew insertion 648 duringPhysical Design.

SEE Tolerant Semi-Custom Design Flow

More specifically, the soft error-mitigating semiconductor design method600 may be characterized by a semi-custom design flow comprising varioussteps including the following:

1) Specification 610 may comprise using a specification language such asVerilog or VHDL to capture circuit design specifications at a behaviorallevel. This step may include refining technical requirements for thedesired circuit, such as top-level functionality, specific computationalgorithm(s) to be implemented, desirable clock frequencies, packagetype, power supply, communication protocols for external interfaces, andoperational temperature range.

2) Logic Design 620 may comprise coding data flow constraints of eachfunctional block in a specified architecture. Functional block types mayinclude combinational logic elements (e.g., Boolean gates), sequentialelements (e.g., flip flops, latches), finite state machines (implementedin hardware and/or software), and/or arithmetic logic blocks. Duringthis step, an RTL description of logic design may be expressed in adesign language such as Verilog.

3) Synthesis 630 may comprise applying all the above-mentionedbehavioral logic constraints to ensure the design meets functionalityand speed requirements, and mapping of the design to standard cells inthe technology. Logic synthesis may include automatically reducing RTLfrom the previous step(s) to gate-level logic (e.g., AND, NOT, wires)with the help of a logic library to produce a netlist. By way ofdefinition, a netlist refers herein to a description of the connectivityof an electronic circuit. In its simplest form, a netlist consists of alist of the electronic components in a circuit and a list of the nodesto which these components are connected. A network (net) may be definedas a collection of two or more interconnected components. The structure,complexity and representation of netlists may vary considerably, but thefundamental purpose of any netlist is to convey connectivityinformation. Netlists often provide instances, nodes, and perhaps someattributes of the components involved.

4) Physical Design 640 includes a number of design decision supportsteps, many of which may be supported by automation, and that ultimatelyproduce a layout that is ready to support circuit fabrication. Ofparticular interest in the context of the present invention are thesteps of floorplan/placement, clock tree distribution, and routing:

4.a) Placement 642 includes optimizing the design for minimum area toallow use of fewer resources and/or to increase the speed of the system.

4.b) Clock Tree Distribution 646 comprises employment of clock(s) tominimize the skew and insertion delay. If clocking is skewedintentionally to improve the setup slack, such a design feature ischaracterized as useful skew.

4.c) Routing 650 includes calculating delays for fanout of wire in adevice.

5) Physical Verification 660 includes checking the correctness of thegenerated layout design.

TMR implementation is not straightforward in a standard cell-baseddigital design which uses computer-aided design (CAD) tools forSynthesis and Physical design phases of an ASIC design flow as describedabove for FIG. 6 . As described hereinbelow, certain embodiments of thepresent invention comprise an automation methodology that may map theintended registers in a design's Verilog RTL with triplicated cellsduring Synthesis, that may guarantee the minimum distance between memoryelements during Placement and Routing, and that may insert complementaryclock delay (useful skew), all leading to a SEE-tolerant standardcell-based digital design. As illustrated in FIG. 6 , triplicationscheme insertion 632 may be carried out during Synthesis 630 itself,whereas the spatial separation 644 between the TMR memory elements maybe applied as constraints during Placement 642 and clock skew or delayinsertion 648 may be carried out during the Clock Tree Distribution 646phase of a Physical Design 640. The resultant semi-custom design flowmay advantageously mitigate soft errors (SEUs and SETs) in the digitallogic realized.

TMR Insertion during Synthesis

Referring now to FIG. 7 , the Logic Synthesis flow 630 according to anembodiment of the present invention will now be described in detail.Automated steps may comprise 1) Load Timing Libraries and RTL 702, 2)Apply Synopsis Design Constraint (SDC) and set attribute(s) to avoidundesirable flip-flops 704; 3) Synthesis Design 706; and 4) Dump (e.g.,Write) Final Netlist 708.

Referring now to FIG. 8A, a modified Logic Synthesis flow 800 accordingto an embodiment of the present invention will now be described indetail. In addition to synthesis steps 702, 704, 706, and prior towriting of a final netlist 708, the target registers (e.g., singleflops) to be replaced as TMR insertion may be mapped to TMR logicthrough a reading of the TMR netlist 802. At step 812, incrementalsynthesis may be performed for further optimization in the TMR logicprior to dumping of the TMR-based netlist (step 708).

Still referring to FIG. 8A, and referring additionally to FIGS. 8B, 8C,and 8D, exemplary implementations of step 802 for replacing single flopswith TMR netlist will now be described in detail. For example, andwithout limitation, in FIG. 8B at line 832, TMR_DFQD.v is a gate levelnetlist implementing TMR as shown in FIGS. 4 and 5 as described above.The for loop at line 834 of the script may search for all flip-flopsthat are mapped to DFQD* type whereas the command at line 836 mayreplace the cell with TMR netlist. Each flip-flop kind in the technologylibrary may have its corresponding TMR gate level netlist.

As application of the TMR methodology increases power consumption andarea of the digital logic, the floorplan may not allow triplication ofevery register on the chip (i.e., triplicating all the registers in RTL,as implemented 820 in exemplary rtl code snippet 822 and exemplary TMRalgorithm snippet 824 of FIG. 8B). Alternatively, FIGS. 8C and 8Dillustrate certain embodiments 840, 860 of the method aspect of thepresent invention that may support the following cases, respectively,both of which may be advantageous for digital design:

1. Triplicating only those registers that have *tmr* as the instancename in RTL (as implemented 840 in exemplary rtl code snippet 842 andexemplary TMR algorithm snippet 844 of FIG. 8C).

2. Triplicating registers in one of the hierarchical modules in RTL (asimplemented 860 in exemplary rtl code snippet 862 and exemplary TMRalgorithm snippet 864 of FIG. 8D).

Memory Elements Spatial Separation

Referring again to FIG. 6 , accomplishment of spatial separation 644between TMR memory elements during Placement 642 according toembodiments of the present invention will now be described in detail.Referring additionally to FIG. 9 , a spacing method 900 mayadvantageously place sequential elements in the TMR such that thesenodes are separated spatially in the floorplan by a significant distanceto ensure that only one node may be affected by an ionizing particle. Asshown in the exemplary script 904 at line 910, the spacing command mayenable putting such a spacing constraint on a selected TMR module.

Clock Delay Insertion/Clock Triplication

Referring again to FIG. 6 , accomplishment of clock delay/skew insertion648 during Clock Tree Distribution 646 according to embodiments of thepresent invention will now be described in detail. Referringadditionally to FIG. 10 , a clock delay insertion/clock triplicationmethod 1000 may advantageously place signal driving clocks to complementeach TMR module so as to ensure masking of glitches and prevent theirpropagation as soft errors. As shown in the exemplary script 1004 atlines 1010 and 1012, the delay commands may allow delay insertion whilesynthesizing the clock distribution network. For example, and withoutlimitation, three driving clocks may be configured to introduce delaysof 0 nanoseconds (ns), 0.5 ns, and 1.0 ns, respectively, toadvantageously facilitate SET mitigation.

Referring now to the schematic block diagram of FIG. 11 , a softerror-mitigating semiconductor design system 1100, also referred to as asoft error-mitigating ASIC design system, a semiconductor designservice, or a semiconductor design solution, is illustrated inaccordance with an exemplary embodiment of the present invention. Thoseskilled in the art will understand that the principles of the presentdisclosure may be implemented on or in data communication with any typeof suitably arranged device or system configured to automate ASIC designflow.

In the exemplary configuration shown in FIG. 11 , the softerror-mitigating semiconductor design system 1100 may comprise aprocessor 1112 (also referred to herein as a “microprocessor” or“central processing unit (CPU)) that may be operable to accept andexecute computerized instructions, and also the data store 1114 that maystore data and instructions used by the processor 1112. The processor1112 may be positioned in data communication with some number ofexternal devices and may be configured to direct input from suchexternal devices to the data store 1114 for storage and subsequentretrieval. For example, and without limitation, the processor 1112 maybe configured in data communication with downstream networking resources(e.g., a wide area network (WAN) 1130) via a short-range wirelessinterface 1108 (e.g., Bluetooth®) and/or via a wired data port interface1110 (e.g., USB). Using such data interfaces, the processor 1112 may beconfigured to direct input received from components of the WAN 1130 tothe data store 1114 for storage. Similarly, the processor 1112 may beconfigured to retrieve data from the data store 1114 to be forwarded asoutput to various components of the WAN 1130.

For example, and without limitation, the computerized instructions ofthe soft error-mitigating semiconductor design system 1100 may beconfigured to implement a Specification Subsystem 1120, a Logic DesignSubsystem 1122, a Synthesis Subsystem 1124, a Physical Design Subsystem1126, and/or a Physical Verification Subsystem 1128 that may be storedin the data store 1114 and retrieved by the processor 1112 forexecution. The Specification Subsystem 1120 may be operable to implementfunctionality as described in design Specification phase 610 of FIG. 6above. The Logic Design Subsystem 1122 may be operable to implementfunctionality as described in Logic Design phase 620 of FIG. 6 above.The Synthesis Subsystem 1124 may be operable to implement functionalityas described in Logic Synthesis phase 630 (including TMR insertion 632)of FIG. 6 above. The Physical Design Subsystem 1126 may be operable toimplement functionality as described in Physical Design phase 640(including Memory Elements Spatial Separation 644 and/or ClockDelay/Skew Insertion 648) of FIG. 6 above. The Physical VerificationSubsystem 1128 may be operable to implement functionality as describedin Physical Verification phase 660 of FIG. 6 above.

A person of skill in the art will immediately recognize that anadvantageous implementation of the soft error-mitigating semiconductordesign system 1100 may employ any or all of Specification Subsystem1120, Logic Design Subsystem 1122, Synthesis Subsystem 1124, PhysicalDesign Subsystem 1126, and/or Physical Verification Subsystem 1128collocated upon a single host computing device or distributed among twoor more host computing devices. For example, and without limitation, thevarious components of the soft error-mitigating semiconductor designsystem 1100 may be implemented onboard an application host/server 1102.

Those skilled in the art will appreciate that the present disclosurecontemplates the use of computer instructions and/or systemsconfigurations that may perform any or all of the operations involved inASIC design flow. The disclosure of computer instructions that includeSpecification Subsystem 1120 instructions, Logic Design Subsystem 1122instructions, Synthesis Subsystem 1124 instructions, Physical DesignSubsystem 1126 instructions, and/or Physical Verification Subsystem 1128instructions is not meant to be limiting in any way. Those skilled inthe art will readily appreciate that stored computer instructions and/orsystems configurations may be configured in any way while stillaccomplishing the many goals, features and advantages according to thepresent disclosure.

As described above, embodiments of the present invention mayadvantageously mitigate SEEs manifesting as soft errors due tocorruption of the data in storage nodes/registers. More specifically,embodiments of the present invention may advantageously improve the TMRautomation methodology by introducing additional stages/steps duringsynthesis and physical design. The intended registers in the Verilog RTLmay be mapped with triplicated cells during synthesis and additionalconstraints during placement and routing may optimize distance betweenmemory elements in a TMR. Although the methodology is verified on asimple design, it may be advantageously scalable to large designsconsisting of multi-million standard cells. Furthermore, embodiments ofthe present invention may relax constraints imposed on RTL engineers tomake rad-hard designs, as automation introduces TMR registers, memoryspacing, and clock triplication to augment the design engineer'sfunctional requirements-driven specification.

In some embodiments, the method or methods described above may beexecuted or carried out by a computing system including a tangiblecomputer-readable storage medium, also described herein as a storagemachine, that holds machine-readable instructions executable by a logicmachine (i.e., a processor or programmable control device) to provide,implement, perform, and/or enact the above-described methods, processesand/or tasks. When such methods and processes are implemented, the stateof the storage machine may be changed to hold different data. Forexample, the storage machine may include memory devices such as varioushard disk drives, CD, or DVD devices. The logic machine may executemachine-readable instructions via one or more physical informationand/or logic processing devices. For example, the logic machine may beconfigured to execute instructions to perform tasks for a computerprogram. The logic machine may include one or more processors to executethe machine-readable instructions. The computing system may include adisplay subsystem to display a graphical user interface (GUI) or anyvisual element of the methods or processes described above. For example,the display subsystem, storage machine, and logic machine may beintegrated such that the above method may be executed while visualelements of the disclosed system and/or method are displayed on adisplay screen for user consumption. The computing system may include aninput subsystem that receives user input. The input subsystem may beconfigured to connect to and receive input from devices such as a mouse,keyboard or gaming controller. For example, a user input may indicate arequest that certain task is to be executed by the computing system,such as requesting the computing system to display any of theabove-described information or requesting that the user input updates ormodifies existing stored information for processing. A communicationsubsystem may allow the methods described above to be executed orprovided over a computer network. For example, the communicationsubsystem may be configured to enable the computing system tocommunicate with a plurality of personal computing devices. Thecommunication subsystem may include wired and/or wireless communicationdevices to facilitate networked communication. The described methods orprocesses may be executed, provided, or implemented for a user or one ormore computing devices via a computer-program product such as via anapplication programming interface (API).

While the above description contains much specificity, these should notbe construed as limitations on the scope of any embodiment, but asexemplifications of the presented embodiments thereof. Many othermodifications and variations are possible within the teachings of thevarious embodiments. While the invention has been described withreference to exemplary embodiments, it will be understood by thoseskilled in the art that various changes may be made and equivalents maybe substituted for elements thereof without departing from the scope ofthe invention. In addition, many modifications may be made to adapt aparticular situation or material to the teachings of the inventionwithout departing from the essential scope thereof. Therefore, it isintended that the invention not be limited to the particular embodimentdisclosed as the best or only mode contemplated for carrying out thisinvention, but that the invention will include all embodiments fallingwithin the scope of the appended claims. Also, in the drawings and thedescription, there have been disclosed exemplary embodiments of theinvention and, although specific terms may have been employed, they are,unless otherwise stated, used in a generic and descriptive sense onlyand not for purposes of limitation, the scope of the invention thereforenot being so limited. Moreover, the use of the terms first, second, etc.do not denote any order or importance, but rather the terms first,second, etc. are used to distinguish one element from another.Furthermore, the use of the terms a, an, etc. do not denote a limitationof quantity, but rather denote the presence of at least one of thereferenced item.

Thus, the scope of the invention should be determined by the followingclaims and their legal equivalents, and not limited by the examplesgiven. While the invention has been described and illustrated withreference to certain fabricated embodiments thereof, those skilled inthe art will appreciate that various changes, modifications andsubstitutions can be made therein without departing from the spirit andscope of the invention. It is intended, therefore, that the invention belimited only by the scope of the claims which follow, and that suchclaims be interpreted as broadly as possible.

What is claimed is:
 1. A soft error-mitigating semiconductor designsystem comprising: a synthesis subsystem configured to: receive acircuit design specification comprising at least one sequential elementdefinition, and determine, using the at least one sequential elementdefinition, a triple modular redundancy (TMR) configuration comprisingthree redundant sequential element definitions; and a physical designsubsystem configured to: determine, using the TMR configuration, a clockskew insertion definition and a spatial separation definition, andgenerate a layout characterized by the TMR configuration, by the clockskew insertion definition, and by the spatial separation definition. 2.The soft error-mitigating semiconductor design system according to claim1, wherein the clock skew insertion definition comprises a single globalclock signal configured to drive each of three delay logic elements eachcomprising a respective distinct offset.
 3. The soft error-mitigatingsemiconductor design system according to claim 1, wherein the clock skewinsertion definition comprises three clock signals each configured todrive a respective one of three delay logic elements each comprising arespective asynchronous offset.
 4. The soft error-mitigatingsemiconductor design system according to claim 1, wherein the at leastone sequential element definition is of a storage register type.
 5. Thesoft error-mitigating semiconductor design according to claim 1, whereinthe synthesis subsystem is further configured to determine, using the atleast one sequential element definition, the triple modular redundancy(TMR) configuration further comprising a voter element definitionconfigured to receive a respective output from each of the threeredundant sequential element definitions and to generate, usingmajority-voting logic, a fault-free output.
 6. The soft error-mitigatingsemiconductor design system according to claim 1, wherein the synthesissubsystem is further configured to receive the circuit designspecification represented in a specification format selected from thegroup consisting of Verilog and Very High-Speed Integrated CircuitHardware Description Language (VHDL).
 7. The soft error-mitigatingsemiconductor design system according to claim 1, wherein the physicaldesign subsystem is further configured to determine, using the TMRconfiguration, the spatial separation definition configured to positioneach of three redundant sequential element definitions of the triplemodular redundancy (TMR) using a Single Event Effect (SEE)-mitigatingspacing constraint.
 8. A soft error-mitigating semiconductor designsystem comprising a computer processor and a non-transitorycomputer-readable storage medium comprising a plurality of instructionswhich, when executed by the computer processor, is configured to:receive a circuit design specification comprising at least onesequential element definition, determine, using the at least onesequential element definition, a triple modular redundancy (TMR)configuration comprising three redundant sequential element definitions,determine, using the TMR configuration, a clock skew definition and aspatial separation definition, and generate a layout characterized bythe TMR configuration, by the clock skew definition, and by the spatialseparation definition.
 9. The soft error-mitigating semiconductor designsystem according to claim 8, wherein the clock skew insertion definitioncomprises a single global clock signal configured to drive each of threedelay logic elements each comprising a respective distinct offset. 10.The soft error-mitigating semiconductor design system according to claim8, wherein the clock skew insertion definition comprises three clocksignals each configured to drive a respective one of three delay logicelements each comprising a respective asynchronous offset.
 11. The softerror-mitigating semiconductor design system according to claim 8,wherein the at least one sequential element definition is of a storageregister type.
 12. The soft error-mitigating semiconductor design systemaccording to claim 8, the plurality of instructions further configuredto determine, using the at least one sequential element definition, thetriple modular redundancy (TMR) configuration further comprising a voterelement definition configured to receive a respective output from eachof the three redundant sequential element definitions and to generate,using majority-voting logic, a fault-free output.
 13. The softerror-mitigating semiconductor design system according to claim 8, theplurality of instructions further configured to receive the circuitdesign specification represented in a specification format selected fromthe group consisting of Verilog and Very High-Speed Integrated CircuitHardware Description Language (VHDL).
 14. The soft error-mitigatingsemiconductor design system according to claim 8, the plurality ofinstructions further configured to determine, using the TMRconfiguration, the spatial separation definition configured to positioneach of three redundant sequential element definitions of the triplemodular redundancy (TMR) using a Single Event Effect (SEE)-mitigatingspacing constraint.
 15. A soft error-mitigating semiconductor designsystem configured to: receive a circuit design specification comprisingat least one sequential element definition, determine, using the atleast one sequential element definition, a triple modular redundancy(TMR) configuration comprising three redundant sequential elementdefinitions, determine, using the TMR configuration, a clock skewinsertion definition and a spatial separation definition, and generate alayout characterized by the TMR configuration, by the clock skewinsertion definition, and by the spatial separation definition.
 16. Thesoft error-mitigating semiconductor design system according to claim 15,wherein the clock skew insertion definition comprises a single globalclock signal configured to drive each of three delay logic elements eachcomprising a respective distinct offset.
 17. The soft error-mitigatingsemiconductor design system according to claim 15, wherein the clockskew insertion definition comprises three clock signals each configuredto drive a respective one of three delay logic elements each comprisinga respective asynchronous offset.
 18. The soft error-mitigatingsemiconductor design according to claim 15, further configured todetermine, using the at least one sequential element definition, thetriple modular redundancy (TMR) configuration further comprising a voterelement definition configured to receive a respective output from eachof the three redundant sequential element definitions and to generate,using majority-voting logic, a fault-free output.
 19. The softerror-mitigating semiconductor design system according to claim 15,further configured to receive the circuit design specificationrepresented in a specification format selected from the group consistingof Verilog and Very High-Speed Integrated Circuit Hardware DescriptionLanguage (VHDL).
 20. The soft error-mitigating semiconductor designsystem according to claim 15, further configured to determine, using theTMR configuration, the spatial separation definition configured toposition each of three redundant sequential element definitions of thetriple modular redundancy (TMR) using a Single Event Effect(SEE)-mitigating spacing constraint.